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Journal of the Korean Ceramic Society 1995;32(3): 371. |
| ECR 산소 플라즈마에 의한 $SiO_2$ 박막의 성장 거동 및 전기적 특성 |
| 안성덕, 이원종 |
| 한국과학기술원 전자재료공학과 |
| Growth and Electrical Characteristics of Ultrathin $SiO_2$ Film Formed in an Electron Cyclotron Resonance Oxygen Plasma |
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| ABSTRACT |
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Silicon oxide films were grown on single-crystal silicon substrates at low temperatures (25~205$^{circ}C$) in a low pressure electron cyclotron resonance (ECR) oxygen plasma. The growth rate of the silicon oxide film increased as the temperature increased or the pressure decreased. Also, the thickness of the silicon oxide film increased at negative bias voltage, but not changed at positive bias voltage. The growth law of the silicon oxide film was approximated to the parabolic form. Capacitance-voltage (C-V) and current density-electric field (J-E) characteristics were studied using Al/SiO2/p-Si MOS structures. For a 10.2 nm thick silicon oxide film, the leakage current density at the electric field of 1 MVcm-1 was less than 1.0$times$10-8Acm-2 and the breakdown field was higher than 10 MVcm-1. The flat band voltage of Al/SiO2/p-Si MOS capacitor was varied in the range of -2~-3 V and the effective dielectric constant was 3.85. These results indicate that high quality oxide films with properties that are similar to those of thermal oxide film can be fastly grown at low temperature using the ECR oxygen plasma. |
| Key words:
ECR oxygen plasma, $SiO_2$, Parabolic growth |
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