| Wafer Sawing 공정의 폐슬러리로부터 금속 실리콘 회수에 관한 연구 |
| 김종영, 김응수, 황광택, 조우석, 김경자 |
| 한국세라믹기술원 이천분원 |
| Recovery of Metallurgical Silicon from Slurry Waste |
| Jong-Young Kim, Ung-Soo Kim, Kwang-Taek Hwang, Woo-Seok Cho, Kyung-Ja Kim |
| Icheon Branch, Korea Institute of Ceramic Engineering and Technology |
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| ABSTRACT |
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Metallurgical grade silicon was recovered from slurry waste for ingot sawing process by acid leaching and thermal treatment. SiC abrasive was removed by gravity concentration and centrifugation. Metal impurities were removed by the acid leaching using HF/HCl. The remaining SiC was separated by the thermal treatment at $1600^{circ}C$ in an inert atmosphere by the difference in melting points. The purity of the obtained silicon was found to be around 99.7%. |
| Key words:
Silicon, Slurries |
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