저온동시소성용 감광성 은(Ag)페이스트의 광식각 특성 |
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Photolithographic Properties of Photosensitive Ag Paste for Low Temperature Cofiring |
Seong-Dae Park, Na-Min Kang1, Jin-Kyu Lim2, Dong-Kook Kim2, Nam-Kee Kang3, Jong-Chul Park |
High Frequency Materials Research Center, Korea Electronics Technology Institute 1Rapidus Inc. 2Department of Chemistry and Material Science, Hanyang Universit 3High Frequency Materials Research Center, Korea Electronics Technology Institut |
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ABSTRACT |
Thick film photolithography is a new technology in that the lithography process such as exposure and development is applied to the conventional thick film process including screen-printing. In this research, low-temperature cofireable silver paste, which enabled the formation of thick film fine-line using photolithographic technology, was developed. The optimum composition for fine-line forming was studied by adjusting the amounts of silver powder, polymer and monomer, and the additional amount of photoinitiator, and then the effect of processing parameter such as exposing dose on the formation of fine-line was also tested. As the result, it was found that the ratio of polymer to monomer, silver powder loading, and the amount of photoinitiator were the main factors affecting the resolution of fine-line. The developed photosensitive silver paste was printed on low-temperature cofireable green sheet, then dried, exposed, developed in aqueous process, laminated, and fired. Results showed that the thick film fine-line under 20$mutextrm{m}$ width could be obtained after cofiring. |
Key words:
Photosensitive, Silver paste, Photolithography, Fine-Line, Low-Temperature cofiring |
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