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J. Korean Ceram. Soc. > Volume 51(4); 2014 > Article
Journal of the Korean Ceramic Society 2014;51(4): 344.
doi: https://doi.org/10.4191/kcers.2014.51.4.344
인쇄 및 소결조건이 AlN 기판용 후막저항체의 특성에 미치는 영향
구본급
한밭대학교 신소재공학과
Effect of Screen Printing and Sintering Conditions on Properties of Thick Film Resistor on AlN Substrate
Bon Keup Koo
Department of Materials Science and Engineering, Hanbat National University
ABSTRACT
$RuO_2$-based high frequency thick-film resistor paste was printed at the speed of 10, 100, 300 mm/sec on the AlN substrate, and then sintered at between 750 and $900^{circ}C$. The sintered thick films were characterized in terms of printing and sintering conditions. With increasing printing speed, the thickness and roughness of sintered film increased. The resistance of the thick film resistor was reduced by increasing the printing speed from 10 to 100 mm/sec, but did not significantly change at 300 mm/sec speed. With increasing sintering temperature, the surface roughness and thickness of sintered resistor film decreased. The reduction rate was large in case of fast printed resistor. The resistance of the resistor increased up to $800^{circ}C$ with sintering temperature, but again decreased at the higher sintering temperature.
Key words: Thick film resistor, Screen printing conditions, Sintering temperature, Film thickness, Surface roughness
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