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J. Korean Ceram. Soc. > Volume 46(1); 2009 > Article
Journal of the Korean Ceramic Society 2009;46(1): 30.
doi: https://doi.org/10.4191/kcers.2009.46.1.030
Sand Blast를 이용한 Glass Wafer 절단 가공 최적화
서원, 구영보1, 고재용2, 김구성
강남대학교 전자시스템정보공학과
1(주)이피웍스 ESIP연구소
Optimization of Glass Wafer Dicing Process using Sand Blast
Won Seo, Young-Mo Koo1, Jae-Woong Ko2, Gu-Sung Kim
Department of Electronic Engineering, Kangnam University
1ESIP Lab., EPworks Co., Ltd.
2Korea Institute of Materials Science
A Sand blasting technology has been used to address via and trench processing of glass wafer of optic semiconductor packaging. Manufactured sand blast that is controlled by blast nozzle and servomotor so that 8" wafer processing may be available. 10mm sq test device manufactured by Dry Film Resist (DFR) pattern process on 8" glass wafer of $500{mu}m's$ thickness. Based on particle pressure and the wafer transfer speed, etch rate, mask erosion, and vertical trench slope have been analyzed. Perfect 500 um tooling has been performed at 0.3 MPa pressure and 100 rpm wafer speed. It is particle pressure that influence in processing depth and the transfer speed did not influence.
Key words: Sand blast, Glass wafer, Etching
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