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Journal of the Korean Ceramic Society
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J. Korean Ceram. Soc.
>
Volume 38(7); 2001
> Article
Journal of the Korean Ceramic Society 2001;38(7): 628.
전자 패키징용 Pb Free 저융점 유리의 제조
최승철
, 이창식
, 유재륜
, 정경원
1
아주대학교 재료공학과
1
대주정밀화학(주)
Fabrication of Pb Free Solder Glass for Electronic Packaging Application
Key words:
Lead free glass
,
Bi based solder glass
,
Softening temperature
,
Thermal expansion
,
Relative dielectric constant
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