Laser Cutting of Thick Diamond Films Using Low-Power Laser

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J. Korean Ceram. Soc. > Volume 37(2); 2000 > Article

Journal of the Korean Ceramic Society 2000;37(2): 140.

저 출력 레이저를 이용한 다이아몬드 후막의 절단

박영준, 백영준

한국과학기술연구원 박막기술연구센터

Laser Cutting of Thick Diamond Films Using Low-Power Laser

ABSTRACT

Laser cutting of thick diamond films is studied using a low-power(10 W) copper vapor laser. Due to the existence of the saturation depth in laser cutting, thick diamond films are not easily cut by low-power lasers. In this study, we have adopted a low thermalconductivity underlayer of alumina and a heating stage (up to 500$^{circ}C$ in air) to prevent the laser energy from consuming-out and, in turn, enhance the cutting efficiency. Aspect ratio increases twice fromm 3.5 to 7 when the alumina underlayer used. Adopting a heating stage also increases aspect ratio and more than 10 is obtained at higher temperatures than 400$^{circ}C$. These results show that thick diamond films can be cut, with low-power lasers, simply by modifying the thermal property of underlayer.

Key words: Laser cutting, Diamond films, Copper vapor laser