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Journal of the Korean Ceramic Society 1996;33(12): 1414. |
무가압 분말 충전 성형법에 의해 제조된 Si 성형체의 반응 소결과 가스압 소결에 관한 연구 |
박정현, 강민수, 백승수1, 염강섭 |
연세대학교 세라믹공학과 1연세대학교 세라믹공학 |
A Study on the Reaction -Bonding and Gas Pressure Sintering of Si Compact made by Pressureless Powder Packing Method |
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ABSTRACT |
Using Si powder with average particle size of 8${mu}{textrm}{m}$ Si compacts were formed by pressureless powder packing method. The compacts were reaction bonded at 1350, 140$0^{circ}C$ for 3~35 hrs under N2/H2 atmosphere and its microstructures were examined. Reaction bonded silicon nitrides showed nitridation of 90% and relative density of 88% After the impregnation of 5wt% MgO as sintering additive using aqueous solution of Mg nitrate the Si compacts were reaction bonded at 140$0^{circ}C$ for 15hrs. The reaction bonded bodies were gas pressure sintered at 180$0^{circ}C$ 190$0^{circ}C$ 200$0^{circ}C$ for 150, 300min. They showed relative density of 95% bending strength of 600MPa and fracture toughness of 6 MPa.m1/2 |
Key words:
Pressureless powder packing method, Reaction bonding, Nitridation, Gas pressure sintering |
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