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J. Korean Ceram. Soc. > Volume 33(12); 1996 > Article
Journal of the Korean Ceramic Society 1996;33(12): 1414.
무가압 분말 충전 성형법에 의해 제조된 Si 성형체의 반응 소결과 가스압 소결에 관한 연구
박정현, 강민수, 백승수1, 염강섭
연세대학교 세라믹공학과
1연세대학교 세라믹공학
A Study on the Reaction -Bonding and Gas Pressure Sintering of Si Compact made by Pressureless Powder Packing Method
ABSTRACT
Using Si powder with average particle size of 8${mu}{textrm}{m}$ Si compacts were formed by pressureless powder packing method. The compacts were reaction bonded at 1350, 140$0^{circ}C$ for 3~35 hrs under N2/H2 atmosphere and its microstructures were examined. Reaction bonded silicon nitrides showed nitridation of 90% and relative density of 88% After the impregnation of 5wt% MgO as sintering additive using aqueous solution of Mg nitrate the Si compacts were reaction bonded at 140$0^{circ}C$ for 15hrs. The reaction bonded bodies were gas pressure sintered at 180$0^{circ}C$ 190$0^{circ}C$ 200$0^{circ}C$ for 150, 300min. They showed relative density of 95% bending strength of 600MPa and fracture toughness of 6 MPa.m1/2
Key words: Pressureless powder packing method, Reaction bonding, Nitridation, Gas pressure sintering
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