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J. Korean Ceram. Soc. > Volume 25(6); 1988 > Article
Journal of the Korean Ceramic Society 1988;25(6): 623.
프릿트 및 소결조건이 Ag 및 Ag/Pd계 후막도체의 미세구조와 전기적성질에 미치는 영향
구본급, 김호기
한국과학기술원 재료공학과
Effect of Frit and Sintering Conditions on the Microstructure and Electrical Property in Ag and Ag/Pd Thick Film Conductors
ABSTRACT
As a function of the composition and content of frit, the electrical property of Ag and Ag/Pd thick film conductors were investigated with microstructure. With increasing sintering temperature in Ag-frit thick film conductors, electrical sheet resistivity decreased, but again increased above 80$0^{circ}C$. And when frit contents is 5wt%, compact and homogenious microstructure can be obtained, then electrical sheet resistivity has minimum value. In Ag/Pd-frit film conductor, the electrical sheet resistivity decreased with increasing sintering temperature. The system which having frit with low softing point has lower sheet resistivity then to add high softening point frit.
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