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Low-Temperature Sintering Behavior of Aluminum Nitride Ceramics with Added Copper Oxide or Copper
Jin-Geun Hwang, Kyung-Sik Oh, Tai-Joo Chung, Tae-Heui Kim, Yeong-Kyeun Paek
J. Korean Ceram. Soc.. 2019;56(1):104-110.   Published online 2018 December 19    DOI: https://doi.org/10.4191/kcers.2019.56.1.05

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Low-Temperature Sintering Behavior of Aluminum Nitride Ceramics with Added Copper Oxide or Copper
Journal of the Korean Ceramic Society. 2019;56(1):104-110   Crossref logo
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Low temperature sintering and microwave dielectric properties of 0.5LaAlO3–0.5SrTiO3 ceramics using copper oxide additions
Ceramics International. 2004;30(8):2067-2073   Crossref logo
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Bonding behavior of copper thick films containing lead-free glass frit on aluminum nitride substrates
Ceramics International. 2004;30(5):661-665   Crossref logo
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Corrosion behavior of silicon nitride bonded silicon carbide refractory material by molten copper and copper slag
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Microstructural features and electrical properties of copper oxide added potassium sodium niobate ceramics
Ceramics International. 2010;36(6):1921-1927   Crossref logo
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ChemInform Abstract: Low-Temperature Sintering of Aluminum Oxide.
ChemInform. 1988;19(52):   Crossref logo
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ChemInform Abstract: SINTERING OF SILICON NITRIDE-YTTRIUM OXIDE-ALUMINUM OXIDE
Chemischer Informationsdienst. 1980;11(27):   Crossref logo
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Low-temperature sintering of magnesium-copper-zinc ferrites
Metal Powder Report. 2002;57(11):36-37   Crossref logo
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Low-temperature sintering of copper-substituted yttrium-iron garnet material
Metal Powder Report. 2003;58(6):51   Crossref logo
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Sintering mechanisms of iron-tin-copper compacts with low-temperature sinterability
Metal Powder Report. 1992;47(6):50   Crossref logo
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