PublisherDOIYearVolumeIssuePageTitleAuthor(s)Link
Journal of Alloys and Compounds10.1016/j.jallcom.2014.07.0732014617367-373Humidity sensing properties of WO 3 thick film resistor prepared by screen printing techniqueArun S Gardehttps://api.elsevier.com/content/article/PII:S0925838814016636?httpAccept=text/xml, https://api.elsevier.com/content/article/PII:S0925838814016636?httpAccept=text/plain
Microelectronics Reliability10.1016/0026-2714(70)90107-1197093231Thick-film screen printinghttps://api.elsevier.com/content/article/PII:0026271470901071?httpAccept=text/xml, https://api.elsevier.com/content/article/PII:0026271470901071?httpAccept=text/plain
Microelectronics Reliability10.1016/0026-2714(75)90679-41975143284Screen: Essential tool for thick film printinghttps://api.elsevier.com/content/article/PII:0026271475906794?httpAccept=text/xml, https://api.elsevier.com/content/article/PII:0026271475906794?httpAccept=text/plain
Microelectronics Reliability10.1016/0026-2714(84)90396-21984244821New stencil screen developments for thick film printinghttps://api.elsevier.com/content/article/PII:0026271484903962?httpAccept=text/xml, https://api.elsevier.com/content/article/PII:0026271484903962?httpAccept=text/plain
Microelectronics Reliability10.1016/0026-2714(73)90335-11973124395-396Changes in thick-film resistor values due to substrate flexureP.J. Holmeshttps://api.elsevier.com/content/article/PII:0026271473903351?httpAccept=text/xml, https://api.elsevier.com/content/article/PII:0026271473903351?httpAccept=text/plain
Microelectronics Reliability10.1016/0026-2714(70)90228-3197096466Variables in the thick-film screen printing process and their effect on register tolerances in large-scale productionhttps://api.elsevier.com/content/article/PII:0026271470902283?httpAccept=text/xml, https://api.elsevier.com/content/article/PII:0026271470902283?httpAccept=text/plain
Microelectronics Reliability10.1016/0026-2714(70)90298-219709123A thick-film resistor glaze of precision propertieshttps://api.elsevier.com/content/article/PII:0026271470902982?httpAccept=text/xml, https://api.elsevier.com/content/article/PII:0026271470902982?httpAccept=text/plain
Ceramics International10.1016/j.ceramint.2008.04.02620093531063-1069Correlation between sintering conditions and water contact angles for Ti–O thick films screen printed on an alumina substrateDanjela Kuščer, Marija Kosec, Janez Holchttps://api.elsevier.com/content/article/PII:S0272884208001910?httpAccept=text/xml, https://api.elsevier.com/content/article/PII:S0272884208001910?httpAccept=text/plain
Microelectronics Reliability10.1016/0026-2714(72)90204-11972113246The direct emulsion screen as tool for high resolution thick film printinghttps://api.elsevier.com/content/article/PII:0026271472902041?httpAccept=text/xml, https://api.elsevier.com/content/article/PII:0026271472902041?httpAccept=text/plain
Materials Letters10.1016/j.matlet.2012.05.11420128320-22Dielectric, ferroelectric, and piezoelectric properties of textured BZT–BCT lead-free thick film by screen printingWangfeng Bai, Bo Shen, Fang Fu, Jiwei Zhaihttps://api.elsevier.com/content/article/PII:S0167577X1200794X?httpAccept=text/xml, https://api.elsevier.com/content/article/PII:S0167577X1200794X?httpAccept=text/plain