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Effect of Screen Printing and Sintering Conditions on Properties of Thick Film Resistor on AlN Substrate
Bon Keup Koo
J. Korean Ceram. Soc.. 2014;51(4):344    DOI: https://doi.org/10.4191/kcers.2014.51.4.344

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Humidity sensing properties of WO 3 thick film resistor prepared by screen printing technique
Journal of Alloys and Compounds. 2014;617:367-373   Crossref logo
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Thick-film screen printing
Microelectronics Reliability. 1970;9(3):231   Crossref logo
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Screen: Essential tool for thick film printing
Microelectronics Reliability. 1975;14(3):284   Crossref logo
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New stencil screen developments for thick film printing
Microelectronics Reliability. 1984;24(4):821   Crossref logo
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Changes in thick-film resistor values due to substrate flexure
Microelectronics Reliability. 1973;12(4):395-396   Crossref logo
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Variables in the thick-film screen printing process and their effect on register tolerances in large-scale production
Microelectronics Reliability. 1970;9(6):466   Crossref logo
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A thick-film resistor glaze of precision properties
Microelectronics Reliability. 1970;9(1):23   Crossref logo
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Correlation between sintering conditions and water contact angles for Ti–O thick films screen printed on an alumina substrate
Ceramics International. 2009;35(3):1063-1069   Crossref logo
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The direct emulsion screen as tool for high resolution thick film printing
Microelectronics Reliability. 1972;11(3):246   Crossref logo
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Applications of Thick Film Screen Printing and Ink Jet Printing for the Manufacturing of Single Use, Disposable Biosensors
ECS Transactions. 2019;16(11):3-13   Crossref logo
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