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The Effect of Slurry and Wafer Morphology on the SiC Wafer Surface Quality in CMP Process
Jong-Hwi Park, Woo-Sung Yang, Jung-Young Jung, Sang-Il Lee, Mi-Seon Park, Won-Jae Lee, Jae-Yuk Kim, Sang-Don Lee, Ji-Hye Kim
J. Korean Ceram. Soc.. 2011;48(4):312    DOI:

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On the Relationship of CMP Wafer Nanotopography to Groove-Scale Slurry Transport
MRS Proceedings. 2005;867:   Crossref logo

Crystal Defect Analysis of Latent Scratch Induced during CMP Process on 4H-SiC Wafer Using Electron Microscopy
Materials Science Forum. 2018;924:531-534   Crossref logo

Experiment on Non-Uniformity of Material Removal on Wafer Surface in Wafer CMP
Solid State Phenomena. 2011;175:187-191   Crossref logo

The micro morphology correction function of a silicon wafer CMP surface
Journal of Semiconductors. 2014;35(5):053002   Crossref logo
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The Mechanism of Organic Base and Surfactant in Silicon Wafer CMP Process
ECS Transactions. 2019;34(1):691-697   Crossref logo
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Characterization of CMP Pad Surface Texture and Pad-Wafer Contact
MRS Proceedings. 2004;816:   Crossref logo

Study on Friction Force Distribution on Silicon Wafer Surface in CMP Process
Advanced Materials Research. 2010;135:90-95   Crossref logo

Study on the Surface Quality of LiNbO3 Wafer by CMP
Key Engineering Materials. 2004;259-260:644-647   Crossref logo

Experimental Study on Parameter Optimization of Silicon Wafer CMP Using Composite Abrasives Slurry
Advanced Materials Research. 2009;69-70:214-218   Crossref logo

Adhesion and Removal of Alumina Slurry Particles on Wafer Surfaces in Cu CMP
Solid State Phenomena. 2005;103-104:275-278   Crossref logo

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