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The Effect of Slurry and Wafer Morphology on the SiC Wafer Surface Quality in CMP Process

Jong-Hwi Park, Woo-Sung Yang, Jung-Young Jung, Sang-Il Lee, Mi-Seon Park, Won-Jae Lee, Jae-Yuk Kim, Sang-Don Lee, Ji-Hye Kim

J. Korean Ceram. Soc.. 2011;48(4):312 DOI: https://doi.org/10.4191/kcers.2011.48.4.312

On the Relationship of CMP Wafer Nanotopography to Groove-Scale Slurry Transport

Gregory P. Muldowney

MRS Proceedings. 2005;867:

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Crystal Defect Analysis of Latent Scratch Induced during CMP Process on 4H-SiC Wafer Using Electron Microscopy

Takahiro Sato, Hiroaki Matsumoto, Seiichi Suzuki, Toshiyuki Isshiki, Nakamura Kuniyasu

Materials Science Forum. 2018;924:531-534

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Experiment on Non-Uniformity of Material Removal on Wafer Surface in Wafer CMP

Jian Xiu Su, Jia Xi Du, Xi Qu Chen, Xin Ning, Ren Ke Kang

Solid State Phenomena. 2011;175:187-191

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The micro morphology correction function of a silicon wafer CMP surface

Haokun Yang, Yuling Liu, Ming Sun, Yingde Li

Journal of Semiconductors. 2014;35(5):053002

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The Mechanism of Organic Base and Surfactant in Silicon Wafer CMP Process

Li Weiwei

ECS Transactions. 2019;34(1):691-697

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Characterization of CMP Pad Surface Texture and Pad-Wafer Contact

Gregory P. Muldowney, David B. James

MRS Proceedings. 2004;816:

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Study on Friction Force Distribution on Silicon Wafer Surface in CMP Process

Jian Xiu Su, Yin Xia Zhang, Jia Xi Du, Ren Ke Kang

Advanced Materials Research. 2010;135:90-95

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Study on the Surface Quality of LiNbO₃ Wafer by CMP

Tong Xing, Ju Long Yuan, W. Li, Shi Ming Ji, L.B. Zhang, Wen Hong Zhao

Key Engineering Materials. 2004;259-260:644-647

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Experimental Study on Parameter Optimization of Silicon Wafer CMP Using Composite Abrasives Slurry

Xue Feng Xu, H.T. Ma, B.X. Ma, Wei Peng

Advanced Materials Research. 2009;69-70:214-218

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Adhesion and Removal of Alumina Slurry Particles on Wafer Surfaces in Cu CMP

Yi Koan Hong, Ja Hyung Han, Jin Hyung Lee, Jin Goo Park, Ahmed A. Busnaina

Solid State Phenomena. 2005;103-104:275-278

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