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Fabrication of Pb Free Solder Glass for Electronic Packaging Application
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J. Korean Ceram. Soc.. 2001;38(7):628

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Emerging Interconnection Technology and Pb-Free Solder Materials for Advanced Microelectronic Packaging
Metals. 2021;11(12):1941   Crossref logo
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Six cases of reliability study of Pb-free solder joints in electronic packaging technology
Materials Science and Engineering: R: Reports. 2002;38(2):55-105   Crossref logo
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Micro-Mechanics of Creep-Fatigue Damage in Pb-Sn Solder Due to Thermal Cycling
Packaging of Electronic and Photonic Devices. 2000;   Crossref logo
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Fabrication of Pb-Free Sn-Bi Solder Using Polyoxyethylene Lauryl Ether
Advanced Materials Research. 2012;569:159-163   Crossref logo
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A Cryo-XPS Study of Triammonium Citrate-KAuCl4-Na2SO3 Electroplating Solutions for Pb-Free Solder Packaging
Journal of Electronic Materials. 2010;39(9):1554-1561   Crossref logo
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The application of lead-free solder to optical fiber packaging
Journal of Electronic Materials. 2004;33(12):1440-1444   Crossref logo
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Optical fiber packaging by lead (Pb)-free solder in V-grooves
Ceramics International. 2004;30(7):1115-1119   Crossref logo
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State of the Art of Lead-Free Solder Joint Reliability
Journal of Electronic Packaging. 2020;143(2):   Crossref logo
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Erratum to: A Cryo-XPS Study of Triammonium Citrate-KAuCl4-Na2SO3 Electroplating Solutions for Pb-Free Solder Packaging
Journal of Electronic Materials. 2010;39(12):2680-2680   Crossref logo
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Effects of Cu contents in Pb-free solder alloys on interfacial reactions and bump reliability of Pb-free solder bumps on electroless Ni-P under-bump metallurgy
Journal of Electronic Materials. 2005;34(1):80-90   Crossref logo
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