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Optimization of Binder Burnout for Reaction Bonded Si
3
N
4
Substrate Fabrication by Tape Casting Method
Ji Sook Park, Hwa Jun Lee, Sung Soo Ryu, Sung Min Lee, Hae Jin Hwang, Yoon Soo Han
J. Korean Ceram. Soc.
2015;52(6):435
DOI:
https://doi.org/10.4191/kcers.2015.52.6.435
Cited By 9
High Thermal Conductivity Silicon Nitride Ceramics
Kiyoshi Hirao, You Zhou, Hideki Hyuga, Tatsuki Ohji, Dai Kusano
J. Korean Ceram. Soc.
2012;49(4):380
DOI:
https://doi.org/10.4191/kcers.2012.49.4.380
Cited By 49
The Effect of Si
3
N
4
Addition on Nitriding and Post-Sintering Behavior of Silicon Powder Mixtures
Young-Jo Park, Jae-Woong Ko, Jae-Wook Lee, Hai-Doo Kim
J. Korean Ceram. Soc.
2012;49(4):363
DOI:
https://doi.org/10.4191/kcers.2012.49.4.363
Cited By 2
Study on Oxidation-
Reaction Bonding
of Aluminum Compact by Pressureless Powder Packing Method
박정현, 홍기의, 염강섭, 유재영
J. Korean Ceram. Soc.
1997;34(1):95
A Study on the Reaction -Bonding and Gas Pressure Sintering of Si Compact made by Pressureless Powder Packing Method
박정현, 강민수, 백승수, 염강섭
J. Korean Ceram. Soc.
1996;33(12):1414
A Study on Fabrication and Properties of Reaction-Bonded Silicon Carbide(I): Effect of pH and Dispersants on the Stable Slip
박현철, 박상환, 최성철
J. Korean Ceram. Soc.
1996;33(10):1109
1
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Materials Science, Ceramics - Q1
Journal Impact Factor 2.7
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