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The Effect of Slurry and Wafer Morphology on the SiC Wafer Surface Quality in CMP Process
Jong-Hwi Park, Woo-Sung Yang, Jung-Young Jung, Sang-Il Lee, Mi-Seon Park, Won-Jae Lee, Jae-Yuk Kim, Sang-Don Lee, Ji-Hye Kim
J. Korean Ceram. Soc. 2011;48(4):312
DOI: https://doi.org/10.4191/kcers.2011.48.4.312
      
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