Effect of Interlayer Materials on Bending Strength and Reliability of Si<TEX>$_3$</TEX>N<TEX>$_4$</TEX>/S. S316 Joint

,; ,; ,; ,; ,; ,; ,; ,; ,; ,

J. Korean Ceram. Soc. > Volume 35(3); 1998 > Article

Journal of the Korean Ceramic Society 1998;35(3): 219.

Si$_3$N$_4$/S. S316 접합에서 중간재가 접합강도 및 신회도에 미치는 영향

윤호욱, 박상환¹, 최성민², 임연수¹, 정윤중¹

KIA-ASIA MOTORS 기술연구소
¹명지대학교 공과대학 무기재료공학과
²명지대학교 공?해가 무기재료공학과

Effect of Interlayer Materials on Bending Strength and Reliability of Si$_3$N$_4$/S. S316 Joint

ABSTRACT

Various interlayer materials have been tested for active metal(Cusil ABA) brazing of Si3N4/S. S316 joint. In general multilayer joint had higher strength(80-150 MPa) and better reliability than monolayered one. The joint with Cu(0.2)/Mo(0.3)/Cu(0.2mm) interlayer showed the highest bending strength of abou 490 MPa and the joint with Cu(0.2)/Mo(0.3mm) interlayer the best reliability (14.6 Weibull modulus). The stresses distributed in joint materials during 4-point bending test were estimated by CAE von Mises analysis; the estimated stresses were In good agreement with the measured data. In multilayer joint Cu was though to reduce the residual stresses induced by the difference in thermal expansion coefficient between the ceramic Mo and metal It apperared that a Cu/Mo was optimum interlayer material for Si3N4/S. S316 joint with high bending strength (420 MPa) and reliability. In addition the various shapes and types of compound were examined by EPMA in joining interface.

Key words: Ceramic/metal joint, Buffer layer, thermal stress, Bending strength, Reliability